Capabilities

From chip to product, from hardware to software—full-chain embedded R&D services.

Embedded Software & Firmware

Bare-metal and RTOS (FreeRTOS/RT-Thread/Zephyr) development on ARM Cortex-M/A, RISC-V and DSP platforms—bootloaders, drivers, low-power design, and communication/industrial protocol stacks.

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Embedded Linux / Android

Kernel tailoring and porting, device tree and driver development, Yocto/Buildroot root filesystems, multimedia and graphics pipelines, Android BSP/HAL and framework customization, secure boot.

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Hardware Design & PCB

Chip selection, schematic and power design, high-speed signals (DDR/PCIe/USB), 4–16 layer PCB layout, SI/PI/EMC optimization, board bring-up and mass-production ramp-up.

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IoT End-to-End Solutions

Low-power device firmware, OTA updates, short-range/wide-area/LPWAN communication, cloud integration (AWS/Azure/Alibaba/Huawei/Tuya), edge computing and on-device AIoT.

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FPGA Development

Verilog/VHDL/SystemVerilog RTL design, custom IP cores, Zynq/UltraScale+ SoC hardware-software co-design, high-speed interfaces and DSP IP, UVM verification and prototyping.

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Testing & Quality Assurance

Unit/integration/system testing, hardware-in-the-loop, automated regression, static analysis (cppcheck/Coverity), MISRA C compliance and continuous integration.

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Certification & Compliance

Wireless (FCC/CE-RED/SRRC/KC), safety (UL/CSA/CCC), and industry/environmental standards including AEC-Q100/ISO 26262, IEC 62304, RoHS/REACH.

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Project Delivery Process

A mature, standardized methodology ensuring every project progresses efficiently and delivers on time.

1

Requirements

2

Feasibility

3

Quotation

4

Contract

5

Architecture

6

Iterative Dev

7

Milestone Review

8

System Testing

9

Delivery

10

Certification

11

Production Ramp-Up

12

Post-Launch Support

Engagement Models

Flexible ways to engage, matched to your stage and scenario.

Project Outsourcing

Well-defined projects with clear scope. Fixed-price turnkey delivery with defined acceptance criteria and milestone-based payments.

Staff Augmentation (On-site/Remote)

Teams needing embedded engineering capacity. Time-and-materials billing; engineers join your team on-site or remotely.

Technical Consulting

Technology selection, design review, problem solving. Hourly/daily billing for expert design review, architecture and diagnosis.

Joint Development

Projects with complementary strengths. Co-investment of resources and effort, collaborative development with shared outcomes and IP.

Product Incubation

Startups with ideas but no technical team. Full support from MVP prototype to mass production to bring concepts to market.

Industry Cases & References

Clients we serve and benchmark D2C brands across power & energy storage, digital, wearables, audio, 3D printing, and AR.

AnkerEcoFlowUgreenAmazfitSoundcoreShokzElegooCrealityRayneoXreal

Have an embedded R&D need? Let's talk about your project.

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